PGA TYPE SEMICONDUCTOR PACKAGE STRUCTURE

摘要

PROBLEM TO BE SOLVED: To make a semiconductor package structure adaptable to the increase of the number of gates or large sizes of semiconductor elements by forming it so as to never cause a strain max. at a bonded zone, ascribing to a board or due to the thermal expansion coefficient difference between the semiconductor elements. SOLUTION: A board 20 made of a composite or ceramic material e.g. GE (glass epoxy) has electric circuits for feeding the power or electric signals to semiconductor elements 10. Pins 40 are to be conductive between the board 20 and elements 10 and conductively fixed to them with solder, etc., and their shapes and materials may be arbitrary so far as they never cause strains max. at bonded zones (solder zones) 30. The shape thereof is typically circular columnar with a circular section but may have an elliptic or middle necked hand drum-like profile and the material thereof may be a coppery one e.g. Cu or Cu alloys and plastics plated with a solder-wetting conductive metal.