METHOD OF SLICING SEMICONDUCTOR SINGLE CRYSTAL INGOT

摘要

PROBLEM TO BE SOLVED: To prevent crack or fracture by slicing a semiconductor single crystal ingot without conforming the travel direction of a wire saw device with the cleavage direction of the semiconductor single crystal ingot. SOLUTION: A protective plate 41 is joined to a position excepting a position of an orientation flat OF or a position which is displaced from the orientation flat by 90 deg., and this protective plate 41 is joined to an adhesion mount 42. That is, either of the cleavage direction of A1 or A2, for example an angleθbetween A1 and the travel direction Y of a wire of the wire saw device is 5 or more. Therefore, a saw mark made by the wire of the wire device is not so conformed with the cleavage direction of the ingot W as the ingot does not crack nor broken in a wafer produced by slicing the ingot W.