发明名称 |
Discrete packaging system for electronic device |
摘要 |
A packaging system includes a bottom having a flat surface for accepting an object, a top having a flat surface and projecting fingers extending from the surface of the top. When the top is assembled to the bottom, the fingers deform, forcing the object against the bottom surface. The object is maintained in position by friction against the bottom surface and the presence of undeformed fingers surrounding the object. The packaging system may be made of static dissipative material and include connection claws and rods for connecting a number of packages in series.
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申请公布号 |
US5673795(A) |
申请公布日期 |
1997.10.07 |
申请号 |
US19950494970 |
申请日期 |
1995.06.26 |
申请人 |
MINNESOTA MINING AND MANUFACTURING COMPANY |
发明人 |
CLATANOFF, WILLIAM J.;FINK, WARREN ALLEN |
分类号 |
H01L21/673;H05K9/00;(IPC1-7):B65D73/02;B65D85/42;H01L23/04 |
主分类号 |
H01L21/673 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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