发明名称 |
PRINTED CIRCUIT BOARD MANUFACTURE |
摘要 |
<p>A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.</p> |
申请公布号 |
EP0797690(A1) |
申请公布日期 |
1997.10.01 |
申请号 |
EP19950940341 |
申请日期 |
1995.12.11 |
申请人 |
ALPHA FRY LIMITED |
发明人 |
SOUTAR, ANDREW, MCINTOSH;MCGRATH, PETER, THOMAS |
分类号 |
C23C18/31;C23C18/32;C23C18/42;H05K3/24;H05K3/42;(IPC1-7):C23C18/42 |
主分类号 |
C23C18/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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