| 摘要 |
An optical integrated circuit (OIC) 10 and an optical fiber array 20 are joined using index matching material, and mounted on a planar bridging structure 30 to form a device which can be readily connected to other devices using conventional optical connectors. The OIC and the fiber array comprise a silicon substrates 100, 200 having bottom surfaces that include reference areas 14, 24, and top sides that include a number of optical paths 16, 50. These paths are positioned above each reference area by an exact distance. Additionally, the bottom sides of the OIC and the fiber array include alignment features 13, 23 which are etched into their substrates and bear a predetermined horizontal relation to the optical paths. The planar bridging structure also includes a reference surface 34 that interfaces the reference surfaces of the OIC and the fiber array to assure that the optical paths are in vertical alignment. The resulting device achieves excellent alignment (i.e., less than 0.1 dB loss on average), without active alignment, when the fibers in the fiber array are carefully selected to have minimum eccentricity and similar diameters. The overall device is structurally completed by placing a bridging substrate 400 on the top surfaces of the OIC and the fiber array and then attaching a pair of spring clips 60 to support them as a unitary structure. <IMAGE> |
