发明名称 Cleaning compositions for removing etching residue with hydroxylamine, alkanolamine, and chelating agent
摘要 A stripping and cleaning composition for removing resists and etching residue from substrates containing hydroxylamine and at least one alkanolamine is described. Further, a cleaning composition for removing etching residue from semiconductor substrates containing hydroxylamine, at least one alkanolamine, at least one chelating agent, and water is described. The preferred chelating agent is 1,2-dihydroxybenzene or a derivative thereof. The chelating agent provides added stability and effectiveness to the cleaning composition.
申请公布号 US5672577(A) 申请公布日期 1997.09.30
申请号 US19950523889 申请日期 1995.09.06
申请人 EKC TECHNOLOGY, INC. 发明人 LEE, WAI MUN
分类号 B24B37/04;C09D9/00;C11D3/20;C11D3/30;C11D3/33;C11D3/34;C11D3/43;C11D7/26;C11D7/32;C11D7/34;C11D7/50;C11D11/00;C23G1/10;C23G1/20;G03F7/42;H01L21/02;H01L21/027;H01L21/30;H01L21/306;H01L21/311;H01L21/321;H01L21/3213;H01L21/768;(IPC1-7):C11D7/26 主分类号 B24B37/04
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