发明名称 |
Interdigitated wirebond programmable fixed voltage planes |
摘要 |
Two interdigitated comb-shaped fixed voltage buses such as a power bus and ground bus, in the form of metallization are provided substantially encircling of an integrated circuit die in an integrated circuit package or other integrated die assembly. Any selection of bonding pads on the die and metallization leads in the assembly may be connected to the fingers of either bus. The length of wire bond or TAB connections and the area occupied by the buses is minimized by the interdigitated geometry of the buses.
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申请公布号 |
US5672909(A) |
申请公布日期 |
1997.09.30 |
申请号 |
US19960688083 |
申请日期 |
1996.07.29 |
申请人 |
AMKOR ELECTRONICS, INC. |
发明人 |
GLENN, THOMAS P.;MOLNAR, RONALD J.;HOLLAWAY, ROY DALE |
分类号 |
H01L23/50;(IPC1-7):H01L23/28 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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