| 摘要 |
A semiconductor laser module is described in which the vicinity of one end of optical fiber 22 is fixed to one side wall of the semiconductor laser module 20, an electronic cooling element 23 is secured to the interior bottom surface of a module package 21, and a substrate 24 composed of a metal plate having a two-level construction in which the upper-level portion 24U and the lower-level portion 24D have a level difference h, the upper surface of the electronic cooling element 23 being secured to the lower surface of upper-level portion 24U, a semiconductor laser 25 being secured to the end portion of the upper surface of upper-level portion 24U, and a lens 26 being mounted on the upper surface of lower-level portion 24D of the substrate; whereby the overall height occupied by all components is reduced by the level difference h as compared with a semiconductor laser module in which the lower surface of the substrate is a single plane.
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