发明名称 COPPER-CLAD LAMINATE AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide a copper-clad laminate which is excellent in thinning, making high productive, making high reliable, and making low costed of a printed-writing board, and its manufacture. SOLUTION: This copper-clad laminate is composed of an electric insulating layer consisting of a thermosetting resin and an electrical insulating whisker, and a copper foil formed on at least its one side. The electrical insulating whisker is blended in the thermosetting resin. After uniformly dispersing the whisker in the thermosetting resin by stirring, it is applied onto a roughened surface of the copper foil wherein at least one side is roughened, and a copper- clad laminate is manufactured by using a prepreg with the copper foil manufacture by removing a solvent by heating and drying.
申请公布号 JPH09254313(A) 申请公布日期 1997.09.30
申请号 JP19960063988 申请日期 1996.03.21
申请人 HITACHI CHEM CO LTD 发明人 OKANO TOKUO;KOBAYASHI KAZUHITO;NAKASO AKISHI
分类号 B32B15/08;B29C70/06;B29K101/10;B29L9/00;B32B15/18;H05K1/03;(IPC1-7):B32B15/08 主分类号 B32B15/08
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