Semiconductor wafer apparatus with integrated circuit forming region

摘要

The apparatus has a region which forms an integrated circuit (1a) with a first contact or bond island (2). A separating section (6) is located round the forming region which separates individual integrated circuits as chips. On the separating section is provided a second contact island (3). The two contact islands are electrically interconnected by a coupler (7) with a bend on the forming region for the integrated circuits. Preferably the surface of the second contact island is greater than that of the first one.