| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to greatly lower the height of a semiconductor laser module without miniaturizing components by fixing and arranging a lens holder to a position where its lower part is lower than the front surface of a substrate by means of a supporting member, thereby lowering the central position of a lens. SOLUTION: A semiconductor laser 1 is mounted on a heat sink and is fixed by soldering atop the substrate 9. The substrate 9 is fixed by soldering atop an electronic cooling element 5. The lens 2 is fixed to a holder 7 and the lens holder 7 is fixed and arranged on the outside part of the substrate 9 by means of a metallic rod 8 in the position where the lower part of the lens holder 7 is lower than the front surface of the electronic cooling element 5. The central position of the lens 2 is, therefore, lowered and the height of the optical axis of the exit light of the semiconductor laser 1 is made lower. The positions of the semiconductor laser 1 and an optical fiber 3 and the height of a module package 6 are made lower as well. Then, the reduction of the thickness is made possible. |
