| 摘要 |
<p>PROBLEM TO BE SOLVED: To restrain grinding of a solder at the time of molding by pressing by a corner portion having a large radius of curvature and fix-pressing by a corner portion having a small radius of curvature during bending of an IC lead in a single process, and to improve workability by employing a single process. SOLUTION: First, in a first process, a bending portion of a lead 9 is pressed to be bent by a corner portion 13b having a large radius of curvature formed on a second pressing metal fitting 13. Then, in a second process, a fix-pressing portion of the lead 9 is pressed to be bent by a corner portion 12b having a small radius of curvature formed on a first pressing metal fitting 12. During the time when the bending portion is molded to reach the fix-pressing portion, the corner portion 13b having a large radius of curvature slides and moves on the surface of the lead 9. Thus, grinding of a solder on the surface of the lead 9 may be restrained. Also, since each process may be carried out by predetermined downward stroke shift of a shaft 10, improvement in workability may be realized.</p> |
