| 摘要 |
The method is applied to a substrate (6) carrying surface mount components (SMD) (7), embossed conductive paths (1) and recessed and prominent test pads (3,5). The underside of a solid coating (8) of any selected thickness, colour, finish and material is covered with fusible adhesive (9), preferably by spraying, to a thickness at least equal to the maximum surface roughness. The underside of the substrate is coated similarly with a combination (10) of adhesive and nonmetallic protection. The adhesive is liquefied by heating between two parallel plates. |
