| 摘要 |
PROBLEM TO BE SOLVED: To enhance productivity in a mold process of a laminated package. SOLUTION: A mold is constituted so that a product positioning pin 14 is allowed to pierce through an intermediate mold 11, for example, made of paper and a lead frame 9 between a lower mold 3 and an upper mold 2 to laminate and position the intermediate mold and the lead frame and the intermediate mold 11 and the lead frame 9 are clamped between both molds 2, 3 and uniformly and closely brought to a contact state by the compression deformation of the intermediate mold 11 to prevent the generation of burr and the laminated package forming part 15 surrounding a semiconductor pellet 8 is formed on the lead frame 9 to be felled with a resin to form a laminated package. The intermediate mold 11 made of paper has a dividing structure such as a perforation capable of separating the intermediate mold 11 from the laminated package after the completion of molding and is impregnated with a release agent if necessary to be made disposable so as to dispense with cleaning. |
