MOLDING METHOD AND APPARATUS AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE PRODUCED BY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To increase the use ratio of a molding resin and to enhance the yield of a resin product. SOLUTION: Upper and lower molds 4a, 4b arranged in mutually opposed relationship and forming a cavity 4c having a shape corresponding to that of the resin main body part of a semiconductor integrated circuit device by mold register and ejector pins 6 and index pins 7 injecting a molding resin 5 into the cavity 4c at a time of resin molding and pressurizing and holding the molding resin 5 are provided and the pin guide holes 4d guiding the ejector pins 6 or the index pins 7 so as to move them up and down and communicating with the cavity 4c are provided to the upper and lower molds 4a, 4b.