Production of substrate

摘要

Production of a substrate comprises securing a metal layer (2,3) to a surface of an insulating layer (1) by active soldering at a solder temperature and using an active solder applied as layer (4). The novelty is that a metallic body (6', 14) consisting of a metallic diffusion solder (7,15) on one outer surface is connected to the metal foil (2',3'). At the active solder temperature, a diffusion solder bond occurs with the metal of the metal foil (2',3').