| 摘要 |
PROBLEM TO BE SOLVED: To improve a contact strength of a circuit conductor while improving close adhesion between a wiring conductor and a circuit conductor and having a good electric conduction between both of them. SOLUTION: A part of a circuit conductor consisting of Cu covers an outer surface of an insulating substrate 3 provided with a wiring conductor 2 consisting of at least one kind of W, Mo so as to be connected to the wiring conductor 2 through an intermediate metal layer 4 main composed of an alloy consisting of at least one kind of Ni, Co, and at least one kind of W, Mo and B. The circuit conductor 2 is made of a double structure of a first circuit layer 5 containing a glass component 2.0 to 8.0wt.% to Cu 100wt.% and being formed to be connected to the intermediate metal layer 4 and a second circuit layer 6 containing CuO 0.5 to 5.0wt.%, W 0.5 to 2.0wt.%, W 0.5 to 2.0wt.% and a glass component 1.0 to 5.0wt.%. |
