| 摘要 |
PROBLEM TO BE SOLVED: To respond to superfining a circuit and requirements of precision, and to increase re liability as a thin board. SOLUTION: In a multilayered wiring board 1 in which there are stacked in a multilayer an insulation layer 2 composed of a composite material mixing an inorganic filler with organic resin; and a conductive circuit 3 composed of a low resistance metal, strength of an insulation layer 4 of an outermost layer is greater than that of an internal insulation layer 5. For instance, fiber- like or needle-like inorganic filler contents are included in the insulation layer 4 of an outermost layer, preferably the strength of the outermost layer is controlled to be 150MPa or more and the internal insulation layer 50MPa or more. |
