| 摘要 |
PROBLEM TO BE SOLVED: To obtain a sealing composition improved in soldering crack resistance (soldering-heat resistance) and reliability of humidity resistance, excellent in molding flow and curability, and can give moldings free from voids and burrs. SOLUTION: This composition comprises an epoxy resin (A), a curing agent (B), an inorganic filler (C), and a silane coupling agent (D). The silane coupling agent (D) comprises 10-95wt.% silane coupling agent (D-1) having organic groups to which epoxy groups are bonded and/or silane coupling agent having organic groups to which sec. amino groups are bonded and 90-10wt.% silane coupling agent (D-2) other than D-1, and the inorganic filler (C) is used in an amount of 85-95wt.% based on the whole composition. |
