| 摘要 |
PROBLEM TO BE SOLVED: To improve adhesion between a composite-oxide high dielectric film, which is dielectric, and a noble metal layer with respect to a thin-film multilayered circuit board used in electronic equipment. SOLUTION: The thin-film multilayer circuit board including a capacitor using a composite-oxide high dielectric film 1 has the structure, wherein metal bonding layers 3, which are smaller than the area of an upper electrode 1 and formed in a plurality of regions in the dispersed pattern, are inserted between the composite-oxide high dielectric film 1 constituting the capacitor and the upper electrode comprising a noble metal layer 2. Therefore, the process for forming the composite-oxide high dielectric film constituting the capacitor on the board, the process for forming the metal bonding layer on the composite- oxide high dielectric film 1 and the process for forming the upper electrode comprising the noble metal layer 2 on the composite-oxide high dielectric film 1 so as to hold the metal bonding layers 3 are included. Furthermore, the area of the metal bonding layers 3 is smaller than the area of the upper electrode, and the metal bonding layers 3 are dispersed and formed in a plurality of the regions. |
