| 摘要 |
PROBLEM TO BE SOLVED: To obtain a wiring board with which the curing of the surface of the resin packed between metallic wirings to a smooth surface is possible by arranging spacers in at least part of the boundary surface of the metallic wirings and transparent electrodes. SOLUTION: An Al film is formed by a sputtering method on a glass substrate 6 to form the metallic wirings 8. Further, the spacers 11 of a silica glass system are dispersed into a solvent and the soln. prepd. in such a manner is applied on the surface of the metallic wirings 8 and is then cured. The UV curing resin 7 is dropped in a prescribed amt. between the respective metallic wirings 8 on this glass substrate 6 and thereafter, a mold plate having the smooth surface through which UV light passes is brought into contact with the UV curing resin 7. Next, a prescribed pressure is applied on the integral assembly of the glass substrate 6 and the mold plate holding the UV curing resin 7 to bring both into tight contact with each other. Next, the integral assembly of the glass substrate 6 and the UV curing resin 7 is peeled from the mold plate and transparent electrodes 9 are formed on the UV curing resin 7 in compliance with the wiring patterns of the metallic wirings 8. An alignment layer is formed thereon, by which the wiring board 3 is obtd. |
