SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND COMPUTER SYSTEM USING IT

摘要

PROBLEM TO BE SOLVED: To obtain a semiconductor integrated circuit device in which input/ output circuits can be arranged so as to be scattered at the inside of a chip without sacrificing an integration degree by contriving the layout of a metal interconnection for the supply of power. SOLUTION: A microprocessor uses an MCC (microcarrier-for-LSI-chip) package in which an LSI chip is mounted on a substrate by using a C4 (controlled- collapse-chip-connection) bonding technique. In the microprocessor, a logic block and a memory block as well as an input/output circuit cluster 10 which uses input circuits 11a to 11d and output circuits 12a to 12d are arranged on the LSI chip so as to be scattered in the most favorable and arbitrary positions with reference to performance. In the input/output cluster 10, various power supplies as power supplies exclusively used for independent input/output circuits in every input/output circuit cluster 10 are supplied to metal interconnections 13a to 13d from respective C4 bonding pads 7a to 7d and to metal interconnections 15a to 15d for supply of a power supply via connecting vias 14a to 14d.