发明名称 BOAT FOR HEAT TREATMENT
摘要 <p>PROBLEM TO BE SOLVED: To obtain a boat which prevents a substrate, to be treated, from becoming a high temperature locally and which restrains damage such as a slip or the like by a method wherein groove parts which are at right angles to the axial direction of a column composed of a light-transmitting tubular body and which are cut down to the inside of a tube wall part at the tubular body are formed at intervals. SOLUTION: A wafer boat 2 which is used to heat-treat a substrate, to be treated, such as, e.g. a wafer, is provided with a ceiling plate 21 and a bottom plate 22 which are arranged so as to be faced to each other at the upper part and the lower part, and six columns 3 (3A to 3F) which are composed of a light-transmitting material, such as e.g. quartz, are installed between them. The six columns 3 (3A to 3F) are arranged along the contour of a wafer W, and they are arranged in such a way that the wafer W makes its way from a part between the two columns 3A, 3B. Many groove parts 4 which are at right angles to the axial direction of the columns 3 (3A to 3F) are formed at intervals in the axial direction in the columns 3. The groove parts 4 are formed so as to be cut down to the inside of tube walls from outer faces of tubular bodies as the columns 3.</p>
申请公布号 JPH09232244(A) 申请公布日期 1997.09.05
申请号 JP19960056676 申请日期 1996.02.20
申请人 TOKYO ELECTRON LTD 发明人 OSAWA SATORU
分类号 H01L21/673;H01L21/205;H01L21/22;H01L21/31;H01L21/324;H01L21/68;(IPC1-7):H01L21/22 主分类号 H01L21/673
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