| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method which can raise the stability of joining between the OLB(outer lead bonding) lead of a TAB(tape automated bonding) tape and the inner lead of a metallic lead frame without raising a manufacture cost. SOLUTION: The electrode 2 of a chip 1 and the ILB(inner lead bonding) lead 3 of a film carrier tape are fixed and connected, and the chip 1 is fixed o the island 13 of the lead frame, and then OLB lead 4 of the film carrier tape and the inner lead 11 of the inner lead 11 are connected with each other. At that time, the LOB lead 4 is fused or half fused and welded with the inner lead 11 by applying a laser beam 23 to the OLB part 14 to join the OLB lead 4 with the inner lead 11. Hereby, the OLB lead 4 itself fuses, so the condition of joining is not affected by the oxide film at the surface of the inner lead 11. Moreover, there is no necessity to form a thick plated layer as a oxidation preventive layer and a plastic transformation layer, so the manufacture cost is reduced. Furthermore, the drop of reliability on connection accompanying plating, such as the migration of the plated layer, etc., ceases to occur. |
