发明名称 COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a component mounting device, which can mount reliably components, such as electronic components, to an object. SOLUTION: A plurality of places of measurement positions, which are obtained by a position measuring means 66 after a prescribed number of components are mounted to an object, on a component holding surface 20a of a holding head 20 and a plurality of places of reference positions, which are obtained by the means 66 when the surface 20a of the head 20 is parallel to the object 19 on an object holding means 40, on the surface 20a are respectively compared with each other by a verifying means 64 of a parallelism detecting means 60, whereby the parallelism of the surface 20a of the head 20 to the object 19 is verified.
申请公布号 JPH09232798(A) 申请公布日期 1997.09.05
申请号 JP19960065232 申请日期 1996.02.27
申请人 SONY CORP 发明人 HONDA TAKAYUKI
分类号 B23P21/00;H05K13/04 主分类号 B23P21/00
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