| 摘要 |
PROBLEM TO BE SOLVED: To prevent the shift of a die pad part in a lead frame at the time of injecting resin so as to improve quality. SOLUTION: A semiconductor chip 1 is fixed on the upper face of the die pad part 2a in the lead frame 2. The lower faces of the lead frame 2 and the die pad 2a are supported by a female mold 4 and a cavity 6 is formed by the female mold 4 and an upper face sealing die 5. Melted resin is injected from a gate part 7 and an upper face sealing resin 8a is formed on the upper face of the lead frame 2. Then, a cavity 10 is formed below the lead frame 2 with the upper face sealing resin 8a and the lower face sealing die 9. The resin is injected from a gate 11 and a lower face sealing resin 8b is formed below the lead frame 2. |
