| 摘要 |
PROBLEM TO BE SOLVED: To prevent a metal wire from breaking at a second bonded part by causing the tip part of each inner lead to have a construction for stopping the movement of the inner lead in the direction of its slipping off to the outside of a package, and connecting the metal wire to the tip part of the inner lead. SOLUTION: A semiconductor device 1 is glued to a tab 7 supported by tab hanging leads 8, and a plurality of inner leads 2a, 2b, 2c are arranged in such a way as to surround the semiconductor device 1. And the tip of each inner lead 2a, 2b, 2c has a bent section 4a, 4b, 4c of a construction of stopping its movement in the direction of slipping off to the outside of a package, and to the tip of each bent section 4a, 4b, 4c a metal wire 5a, 5b, 5c is connected electrically, and a second bonded part is formed. Consequently, it becomes possible to prevent the metal wires 5a, 5b, 5c from breaking at the second bonded part.
|
