| 摘要 |
PROBLEM TO BE SOLVED: To provide a small, thin, multi-pin low cost three-dimensional laminated module by the interlayer connection at high density. SOLUTION: Chips 110 are connected to thin interconnection films 120, these films and thin adhesive films 130 are alternately laminated to directly connect via holes 125 formed through the films 120 to vias 131 formed through the films 130 whereby the via holes can be made fine and at small pitches and hence the inerlayer connection can be made at high density to reduce the module mounting area. Since the number of parts of the module structure is small and lamination process is simple and superior in mass productivity, the cost can be reduced. |
