| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having excellent performance of high reliability and an outer lead with a metallic film capable of easy solder junction as well as cutting down the cost of the materials themselves meeting the requirements for development of the metallic film material having the equivalent performance of Pb-Sn alloy film. SOLUTION: Within the semiconductor device composed of a package part 4 sealing a lead frame mounting a semiconductor element and an external lead 5 protruding from the package part 4, a metallic film 6 is formed on the surface region including the junction surface with the substrate wiring in the case of packaging a printed-substrate to be the surface of the external lead 5 further forming a metallic film of Sn-Cu alloy. Resultantly, the metallic film 6 can be easily solder-junctioned with the printed-substrate as well as due to the hardly oxidizable property of the metallic film 6, high reliable junction can be assured. |
