| 摘要 |
<p>A method for bonding a chip part, having solder bumps on the underside thereof, to a base material. The method includes the steps of placing the chip part at a specific position on the base material, placing a weight on the chip part, the weight being based on the number of solder bumps mounted on the chip part and a surface tension of the solder bumps at melting, and irradiating, with an electromagnetic wave, an upper surface of the weight to transfer heat to the solder bumps through the weight and the chip, thereby melting the solder bumps and bonding the chip part to the base material.</p> |
