发明名称 |
Plastic molding method for semiconductor devices |
摘要 |
A plastic molding method for semiconductor devices, the method including placing semiconductor devices mounted on lead-frames between lower die cavities in a lower die chase block and upper die cavities in an upper die chase block and clamping the upper and lower die chase blocks together; evacuating an ejector chamber in the lower die chase block through a lower die common surface table, evacuating an ejector chamber in the upper die chase block through an upper die common surface table, and evacuating a parting chamber at a parting surface between the lower die chase block and the upper die chase block through one of the lower die common surface table and the upper die common surface table; and injecting a sealing resin into the upper die cavities and the lower die cavities to plastically package the semiconductor devices.
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申请公布号 |
US5662848(A) |
申请公布日期 |
1997.09.02 |
申请号 |
US19960602679 |
申请日期 |
1996.02.16 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
TANAKA, SUEYOSHI;SAKAKIBARA, ZYUNZI;TSUTSUMI, YASUTSUGU |
分类号 |
B29C45/14;B29C45/26;B29C45/34;H01L21/00;H01L21/56;(IPC1-7):B29C33/10;B29C45/02 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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