| 摘要 |
PROBLEM TO BE SOLVED: To produce a resin formed article capable of being wire-bonded and having a plating film with the surface smoothed by forming an electroplating layer low in internal stress on a resin formed article and forming a bright electroplating layer having a great leveling effect thereon. SOLUTION: A synthetic-resin formed article (thermoplastic resin is preferable) is etched as a pretreatment, and then conductivity is imparted to the surface by electroless plating. Subsequently, a low-stress plating film is formed in >=3μm thickness to control the peak of the internal stress at the initial stage of plating to <=1.5kg/mm<2> . Further, a bright electroplating layer having <=10μm surface roughness (Rmax) is formed on the low-stress electroplating layer by the use of an electroplating soln. having a great leveling effect. Consequently, a resin formed article good in heat resistance, without the plating being stripped off, capable of being wire-bonded and having a plating film good in surface smoothness is obtained.
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