| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing semiconductors having high mold releasability and reliability by adding a specific high-density polyethylene to an epoxy resin composition with improved productivity and reduced production costs. SOLUTION: This resin composition comprises (A) an epoxy resin (for example, o-cresol novolak type epoxy resin), (B) a phenolic resin curing agent (for example, a phenol-novolak resin, (C) a curing accelerator (for example, 1,8- diazabicyclo(5,4,0)undecene-7, (D) an inorganic filler (for example, spherical silica powder) and (E) fine particles of high-density polyethylene softening over 120 deg.C, having 80% and higher crystallinity and <=200μm average particle sizes as essential components.
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