发明名称 |
ASSEMBLY MOUNTING TECHNIQUES FOR HEAT SINKS IN ELECTRONIC PACKAGING |
摘要 |
<p>An assembly support mount includes at least two flexible, retention posts spaced apart with ends to engage a heat sink frictionally to support the heat sink relative to an electronic device. The flexible retention posts are attached to a substrate without the need for holes in the substrate and extend past a heat generating device into openings in a heat sink where they are attached by any number of means, preferrably by frictionally engaging the openings in the heat sink.</p> |
申请公布号 |
HU9701129(D0) |
申请公布日期 |
1997.08.28 |
申请号 |
HU19970001129 |
申请日期 |
1997.06.30 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KOSTEVA,STEPHEN JOHN;SAMMAKIA,BAHGAT GHALEB |
分类号 |
H01L23/40 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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