METHOD OF PRODUCING BUMPS ON PADS OF ELECTRONIC COMPONENTS

摘要

The invention concerns a method of transferring amounts of solder which are deposited galvanically on an auxiliary support (3) and are transferred in a remelting process via a solder bump to connection spots of electronic components. In order to transfer the amounts of solder and release the solder material from the auxiliary support, the galvanic solder amount is predominantly produced laterally over an insulating surface layer of the auxiliary support, openings in the insulating layer each exposing a metal layer lying therebelow and serving as a galvanizing base.