| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive resin compsn. excellent in the capability of forming a fine pattern by compounding a specific high-molecular compd. having sites formed by bonding specific alkoxy groups to carboxyl groups with a photoinduced acid generator. SOLUTION: This resin compsn. comprises 75-99.8wt.% high-molecular compd. having a wt.-average mol.wt. of 1,000-1,000,000 and represented by formula I (wherein R<1> , R<3> , and R<7> are each H or methyl; R<2> is a bridged cyclic hydrocarbon group; R<4> is H or a 1-2C hydrocarbon group; R<5> is 1-2C hydrocarbon group; R<6> is a 1-12C hydrocarbon group optionally substd. by an alkoxy group, etc.; x is 0.1-0.9; y is 0.1-0.7; and z is 0-0.7 provided x+y+z=1) and 0.2-25wt.% photoinduced acid generator. Since the site represented by formula II in the compd. represented by formula I can be easily decomposed by a hot acid, a scumless fine resist pattern is obtd. which enables resolving at a low exposure in ArF excimer laser lithography and enables the use of a photoinduced acid generator generating a weak acid. |
