Vorrichtung, insbesondere zur Verwendung in einem elektronischen Steuergerät

摘要

The device has a first component assembly carrier (PCB) (2)and at least one module assembly unit (10) consisting of a second component assembly carrier (PCB) (11) with SMD components (12,13) mounted on it and electrically interconnected via connecting conductors. The module assembly is connected to the first carrier via soldered connections. The second carrier is attached to the first carrier via a large area solder layer (40) between the unpopulated underside (25) of the second carrier and the upper side (5) of the first carrier. The components on the second carrier and conducting connections form at least one electronic circuit to produce at least one function of the module assembly independently of other components on the first carrier.