| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which solves problems such as crack, bending and disconnection of a lead caused by reduction of lead width and thickness when an inner lead pitch is fined and has a narrow pitch inner lead pattern corresponding to narrow pitch multi-electrode of a semiconductor chip in a semiconductor device of a TAB mounting method. SOLUTION: A projection electrode 2 and an inner lead part 3 are connected by applying insulation resin 7 holding adhesion force and contraction stress after setting between a semiconductor chip 1 and a tape carrier of the inner lead part 3 without opening a part of a base film 4 of the inner lead part 3 of a tape carrier connected to the projection electrode 2 of the semiconductor chip 1. Thereby, a conductor wiring material which is thinner than a conventional one can be used for a tape carrier and the inner lead part 3 can be fined for a narrow pitch corresponding to its thickness. |
