| 摘要 |
PROBLEM TO BE SOLVED: To provide circuit connecting parts with excellent conductivity in connection at fine pitches and high current flow by providing an anisotropic conductive film, constructed by adding a specified amount of organic binder to metal powder containing copper component with specified average grain sizes, on a connection terminal on an insulating substrate where conductor circuits are formed. SOLUTION: Circuit connecting part are manufactured which have an anisotropic conductive film, constructed by adding 1-50wt.pts. organic binder 5 to 1wt.pts. metal powder containing copper component with average grain sizes of 1-10 microns. on a connection terminal on an insulating substrate where conductor circuits are formed. Copper alloy powder, copper-silver alloy powder or, etc., is used for the metal powder containing copper component with average grain sizes of 2-8 microns, epoxy resin, urethane resin or, etc., is used as the organic binder and polyimede, polyester or, etc., is used for the insulating substrate. In this way, the circuit connecting parts are provided with high reliability in differently pitched connection, low resistance and high current flow. |
