| 摘要 |
PROBLEM TO BE SOLVED: To realize a very narrow cutting width without hardly generating chipping, etc., by performing the perfect cutting using an excimer laser beam of short wavelength at least when the residual cutting thickness of a substrate is reduced. SOLUTION: The laser beam 18 emitted from an excimer laser oscillation source 14 passes through a mask 15 having a rectangular slit installed on an optical system and reflected by a mirror 16, and a sample 11 installed in a sample tank 12 having a crystal window is irradiated with the Baser beam through a lens system. The sample tank 12 is installed on a movable stage 13 to be controlled in X and Y direction. In the actual cutting, the cutting position is detected by a CCD camera, the X-axis is fixed, and cutting is performed by repeatedly moving the stage 13 in Y-direction. Chipping, cracking, etc., are absent and the cutting width can be <=50μm by using the ArF excimer laser beam at least in completing the cutting of a substrate as a cutting means of the substrate. |
