发明名称 Method of fabricating a semiconductor laser device
摘要 A semiconductor laser device includes: a lower cladding layer; an upper cladding layer having a bottom and a strip-shaped ridge portion projecting from the bottom; a II-VI compound semiconductor active layer interposed between the lower cladding layer and the upper cladding layer; and a burying blocking layer made of an aromatic polyamide resin formed on a bottom of the upper cladding layer so as to be in contact with sides of the stripe-shaped ridge portion.
申请公布号 US5658824(A) 申请公布日期 1997.08.19
申请号 US19950521905 申请日期 1995.08.31
申请人 SHARP KABUSHIKI KAISHA 发明人 ITOH, SHIGETOSHI;OKUMURA, TOSHIYUKI
分类号 H01L33/06;H01L33/12;H01L33/14;H01L33/28;H01L33/44;H01S5/00;H01S5/22;H01S5/223;H01S5/327;H01S5/347;(IPC1-7):H01L21/203 主分类号 H01L33/06
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