发明名称 |
Method of fabricating a semiconductor laser device |
摘要 |
A semiconductor laser device includes: a lower cladding layer; an upper cladding layer having a bottom and a strip-shaped ridge portion projecting from the bottom; a II-VI compound semiconductor active layer interposed between the lower cladding layer and the upper cladding layer; and a burying blocking layer made of an aromatic polyamide resin formed on a bottom of the upper cladding layer so as to be in contact with sides of the stripe-shaped ridge portion.
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申请公布号 |
US5658824(A) |
申请公布日期 |
1997.08.19 |
申请号 |
US19950521905 |
申请日期 |
1995.08.31 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
ITOH, SHIGETOSHI;OKUMURA, TOSHIYUKI |
分类号 |
H01L33/06;H01L33/12;H01L33/14;H01L33/28;H01L33/44;H01S5/00;H01S5/22;H01S5/223;H01S5/327;H01S5/347;(IPC1-7):H01L21/203 |
主分类号 |
H01L33/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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