发明名称 |
System for real-time control of semiconductor wafer polishing including optical monitoring |
摘要 |
A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, a slurry supply system delivering a slurry to the polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly; and an optical measurement system measuring film thickness at multiple different locations on the wafer face while the wafer is under a liquid, wherein drying of the wafer is avoided while the measurements are taken.
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申请公布号 |
US5658183(A) |
申请公布日期 |
1997.08.19 |
申请号 |
US19950547944 |
申请日期 |
1995.10.24 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
SANDHU, GURTEJ S.;DOAN, TRUNG TRI |
分类号 |
B23Q15/013;B23Q15/12;B24B13/015;B24B37/04;B24B49/02;B24B49/04;B24B49/10;B24B49/12;B24B49/14;B24B57/02;G05B19/404;(IPC1-7):B24B49/00;B24B51/00 |
主分类号 |
B23Q15/013 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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