| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin compsn. improved in resistances to moisture and soldering heat by compounding an epoxy resin having a dicyclopentadiene backbone, a specific phenol resin. an inorg. filler, and a cure accelerator. SOLUTION: This compsn. is prepd. by compounding an epoxy resin represented by formula I (wherein (n) is 0 or 1) having a dicyclopentadiene backbone, a phenol resin represented by formula II (wherein (n) is 0, 1, or higher), 25-95wt.% inorg. filler having an average particle size of 30μm or lower, and 0.01-5wt.% phosphorus- or imidazole-based cure accelerator.
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