发明名称 |
Bumpless method of attaching inner leads to semiconductor integrated circuits |
摘要 |
<p>A method of attaching inner leads to the metal electrodes of an integrated-circuit die, in which the tips of the inner leads are pressed onto the metal electrodes by a heated bonding tool. The heat of the bonding tool softens the tips of the inner leads, enabling the inner leads to be directly pressure-welded to the metal electrodes, without the need for intervening soft metal bumps. <IMAGE></p> |
申请公布号 |
EP0789392(A2) |
申请公布日期 |
1997.08.13 |
申请号 |
EP19970300813 |
申请日期 |
1997.02.07 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
KONDO, TOSHINARI |
分类号 |
H01L21/60;H01L21/603;H01L23/50;(IPC1-7):H01L21/603 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|