| 发明名称 |
Method of peeling photo-resist layer without damage to metal wiring |
| 摘要 |
<p>A semiconductor manufacturer peels a photo-resist mask off by using organic alkaline solvent (22a), and the residual alkaline solvent is neutralized with acid before a rinse in pure water so as to prevent a metal wiring from erosion due to strong alkaline solution produced from the residual organic alkaline solvent. <IMAGE></p> |
| 申请公布号 |
EP0789389(A2) |
申请公布日期 |
1997.08.13 |
| 申请号 |
EP19970101496 |
申请日期 |
1997.01.30 |
| 申请人 |
NEC CORPORATION |
发明人 |
SHIMIZU, YUJI;ITO, KOHIRO;MORITOKI, MASASHIGE |
| 分类号 |
G03F7/32;G03F7/40;G03F7/42;H01L21/02;H01L21/027;H01L21/304;H01L21/306;H01L21/3063;H01L21/311;H01L21/3213;(IPC1-7):H01L21/312 |
主分类号 |
G03F7/32 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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