| 摘要 |
<p>PURPOSE: To readily realize multi-function, high density high integration and compactness. CONSTITUTION: A plurality of multilayer wiring boards 1A, 1B, 1C are mutually connected by a plurality of connection pins 13a, 13b and a plurality of pin insertion holes 14a, 14b which are fit and connected to the connection pins and a multi-stage structure is realized. A high consumption power type semiconductor element 4 alone is mounted with a heat sink on the multilayer wiring board 1A of an uppermost stage, and other usual electronic parts are mounted on the multilayer wiring boards 1B, 1C excepting an uppermost stage. A plurality of connection pins 13c for connection to a mounting board is arranged to a full grid array form all over one surface of the multilayer wiring board 1C of a lowermost stage.</p> |
