| 摘要 |
A socket for use in electrically measuring and testing a semiconductor device including a body portion having a guide for holding leads of the semiconductor device, and a cover with a plurality of probes for contacting with the leads of the semiconductor device. The cover has a plurality of out-leads respectively connected to the probes to communicate electrical signals from the probes to an exterior device. The guide of the body portion is provided with a plurality of lead guide holes, and a biasing member for urging the guide toward the cover to ensure consistent contact between each of the probes and a corresponding lead.
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