| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for inexpensively producing an insulating substrate which is stable in electrical connection to an external electric circuit board contg. an org. resin and is highly thermally expandable with high quality. SOLUTION: The wiring board 1 of a package, etc., formed by disposing metallized wiring layers consisting of Cu, etc., on or in the insulating substrate is the sintered compact which is obtd. by firing a molding contg. lithium silicate glass at a ratio of 20 to 80vol.% and fillers contg. a metal oxide having a coefft. of thermal expansion of >=6ppm/ deg.C at 40 to 400 deg.C at 80 to 20vol.% and contains at least a lithium silicate crystal phase as its crystal phase. The sintered compact is composed of the ceramics sintered compact which is >=0.85 the peak intensity ratio expressed by formula I1 /(I1 +I2 ) and is 8 to 18ppm/ deg.C the coefft. of thermal expansion at 40 to 400 deg.C. In the equation, the peak intensity of the (111) face of Li2 Si2 O5 is defined as I1 and the peak intensity of the (020) face of Li2 SiO3 as I2 in the X-ray diffraction measurement chart of the sintered compact. |
