发明名称 |
TAMPERPROOF ELECTRONIC COATING FILM |
摘要 |
Disclosed is a method of forming tamper-proof coatings on electronic devices. The method comprises applying a coating of a silica precursor resin and an inorganic salt onto the electronic device, wherein the inorganic salt is one which reacts with a wet etch to yield an acid or base that damages the electronic device. The coated electronic device is then heated at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix. |
申请公布号 |
JPH09208212(A) |
申请公布日期 |
1997.08.12 |
申请号 |
JP19960272013 |
申请日期 |
1996.10.15 |
申请人 |
DOW CORNING CORP |
发明人 |
ROBAATO CHIYAARUZU KAMIRETSUTEI;ROOREN ANDORIYUU HARUSA;KIISU UINTON MAIKERU |
分类号 |
B05D7/24;C01B33/12;C04B35/14;C04B35/622;C09D183/02;C09D183/04;C23C26/00;H01L21/306;H01L21/56;H01L23/58;H05K3/28 |
主分类号 |
B05D7/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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