发明名称 TAMPERPROOF ELECTRONIC COATING FILM
摘要 Disclosed is a method of forming tamper-proof coatings on electronic devices. The method comprises applying a coating of a silica precursor resin and an inorganic salt onto the electronic device, wherein the inorganic salt is one which reacts with a wet etch to yield an acid or base that damages the electronic device. The coated electronic device is then heated at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.
申请公布号 JPH09208212(A) 申请公布日期 1997.08.12
申请号 JP19960272013 申请日期 1996.10.15
申请人 DOW CORNING CORP 发明人 ROBAATO CHIYAARUZU KAMIRETSUTEI;ROOREN ANDORIYUU HARUSA;KIISU UINTON MAIKERU
分类号 B05D7/24;C01B33/12;C04B35/14;C04B35/622;C09D183/02;C09D183/04;C23C26/00;H01L21/306;H01L21/56;H01L23/58;H05K3/28 主分类号 B05D7/24
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