Apparatus for dipping substrates in processing fluid

摘要

For processing semiconductor substrates in a processing fluid, the substrates are introduced into a processing bath in which the processing fluid is filled. For holding the substrates in the process of introducing them into the processing bath, a holder having a pair of holding rods end a pair of aiding rods is prepared. A periodical linear array of grooves is formed on each rod. The rims of substrates are inserted into respective corresponding grooves on the rods so that the substrates do not touch respective side walls of the grooves in the aiding rod.